AutoGlow 200 Plasma System
The AutoGlow 200 system is designed for up to 200 mm substrates or 8″ wafers, and can perform RIE or plasma processing–depending on which sample carrier used.
The anodized aluminum chamber can accommodate standard O2, Ar or CF4 type gases for etching applications. The well proven electronic, RF generator, match network and gas control is the same as the standard AutoGlow.
The AutoGlow 200 can be used for a variety of applications from plasma activation, cleaning, organic removal, pre-deposition cleaning as well as a variety of etching applications.
Chamber size is 254mm wide x 254mm deep x 101.6mm high.
